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LQFP-64 Li'lBoard page.
Model number: LB8.06.
Description: Use with a 10 mm square body, 0.5 mm lead pitch LQFP package.
Applications: Connect to a chip such as one of the 64-LQFP PICs.
Features:
•Each chip pad is brought out to one solderable I/O pin.
•There are 4 sites for 0805 capacitors, one at each corner of the chip site, where one end of each is grounded, however the other end of each is available via a small pad. These could be used for pull-down resistors if that is more sensible.
•There are 2 3216 (tantalum size A) sites on the bottom side, both are connected to the board power and ground rails.
•There are 4 sets of three pads connected together but otherwise isolated for general signal hookup.
•The I/O pins are grouped in eights.
Images:
SPI: N/A (or yes, depending on what chip is mounted).
Tenth centers: Yes (not directly compatible with solderless breadboards due to square layout).